Gigabyte B760M DS3H AX D4
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  • Gigabyte B760M DS3H AX D4
  • Gigabyte B760M DS3H AX D4
  • Gigabyte B760M DS3H AX D4
  • Gigabyte B760M DS3H AX D4

Gigabyte B760M DS3H AX D4

146,94 €
Impuestos incluidos Recíbelo de 5 a 7 días

Placa Base con CPU Intel ® Socket LGA 1700, compatible con procesadores de la serie 13 y 12. Rendimiento incomparable: solución VRM digital híbrida de 6+2+1 fases. Dual Channel DDR4: 4*DIMMs Compatibilidad con módulo de memoria XMP. Almacenamiento de próxima generación: 2 conectores PCIe 4.0 x4 M.2.

La tecnología PerfDrive integra múltiples configuraciones de BIOS exclusivas de GIGABYTE para permitir a los usuarios equilibrar fácilmente entre diferentes niveles de rendimiento, consumo de energía y temperatura de acuerdo con sus necesidades cuando utilizan procesadores Intel® Core™ de 13.ª generación.

Las placas base GIGABYTE permiten la mejor experiencia de conexión con velocidades de transferencia de datos increíbles a través de la red y el almacenamiento de próxima generación.

Cantidad
En stock

Procesador

- LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors

- L3 cache varies with CPU

Chipset

- Intel® B760 Express Chipset

Memoria

- Support for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules

- 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory

- Dual channel memory architecture

- Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)

- Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules

- Support for Extreme Memory Profile (XMP) memory modules

Gráfica Integrada

Integrated Graphics Processor-Intel® HD Graphics support:

- 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz

- 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz

- 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz

- Support for up to triple-display at the same time

Audio

- Realtek® Audio CODEC

- High Definition Audio

- 2/4/5.1/7.1-channel

- Support for S/PDIF Out

LAN

- Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)

- Módulo de comunicaciones inalámbricas

- AMD Wi-Fi 6E RZ608 (MT7921K) (For PCB rev. 1.0)

- WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands

BLUETOOTH 5.2

- Support for 11ax 80MHz wireless standard and up to 1.2 Gbps data rate

- Intel® Wi-Fi 6E AX210 (For PCB rev. 1.1)

- WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands

BLUETOOTH 5.3

- Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

- Intel® Wi-Fi 6E AX211 (For PCB rev. 1.2)

- WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands

Zócalos de Expansión

CPU:

- 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16

Chipset:

- 2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1

Interfaz de almacenamiento

CPU:

- 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)

Chipset:

- 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)

- 4 x SATA 6Gb/s connectors

- RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices

USB

Chipset:

- 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support

- 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)

- 2 x USB 2.0/1.1 ports on the back panel

Chipset+2 USB 2.0 Hubs:

- 4 x USB 2.0/1.1 ports available through the internal USB headers

Conectores Internos E/S

- 1 x 24-pin ATX main power connector

- 1 x 8-pin ATX 12V power connector

- 1 x CPU fan header

- 3 x system fan headers

- 1 x addressable LED strip header

- 1 x RGB LED strip header

- 2 x M.2 Socket 3 connectors

- 4 x SATA 6Gb/s connectors

- 1 x front panel header

- 1 x front panel audio header

- 1 x USB 3.2 Gen 1 header

- 2 x USB 2.0/1.1 headers

- 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)

- 1 x S/PDIF Out header

- 1 x Q-Flash Plus button

- 1 x reset button

- 1 x reset jumper

- 1 x Clear CMOS jumper

Panel E/S Trasero

- 2 x USB 2.0/1.1 ports

- 1 x PS/2 keyboard/mouse port

- 2 x SMA antenna connectors (2T2R)

- 1 x HDMI port

- 2 x DisplayPorts

- 3 x USB 3.2 Gen 1 ports

- 1 x USB Type-C® port, with USB 3.2 Gen 2 support

- 1 x RJ-45 port

- 3 x audio jacks

Controlador E/S

- iTE® I/O Controller Chip

- Monitorización Hardware

- Voltage detection

- Temperature detection

- Fan speed detection

- Water cooling flow rate detection

- Fan fail warning

- Fan speed control

BIOS

- 1 x 128 Mbit flash

- Use of licensed AMI UEFI BIOS

- PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

Sistema Operativo

- Support for Windows 11 64-bit

- Support for Windows 10 64-bit

Formato

- Micro ATX Form Factor; 24.4cm x 24.4cm

PROD-024657

Ficha técnica

Socket
Intel LGA 1700
Formato Placa
Micro ATX
Memoria
DDR4

Referencias específicas

ean13
4719331850869
mpn
B760M-DS3H-AX-DDR4
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